BACKGROUND

项目背景

中京电子

智能智造

Huizhou CEE Technology Inc. (Stock Code: 002579), founded in 2000, provides customers with one-stop PCB solutions. The company specializes in the R&D, production and sales of rigid multi-layer boards (MLB), high-layer count boards (HLC), high-density interconnect printed circuit boards (HDI), flexible printed circuits and flexible printed circuit assemblies (FPC & FPCA), and rigid-flex boards (R-F). As a key high-tech enterprise under the National Torch Program, it is a vice-chairman unit of the China Printed Circuit Association (CPCA) and one of the drafters of CPCA industry standards, maintaining a leading domestic position in industrial technology and product quality.

Headquartered in Zhongkai High-tech Zone, Huizhou City, Guangdong Province, CEE Group operates four major production bases: CEE Huizhou Production Base in Zhongkai High-tech Zone (Huizhou), CEE Topsun Production Base in Xiangzhou District (Zhuhai), CEE Zhuhai Production Base in Fushan Industrial Zone (Zhuhai), and QuanTech Production Base in Laem Chabang Ayutthaya Industrial Park (Thailand), with a total workforce of over 6,000 employees.